4-6 Layer Mixed-Signal PCB
Publicada el 2026-07-13
Descripción de la oferta
I’m building a compact, 4–6-layer mixed-signal board that will sit at the heart of a new sensor-interface product. The board must collect analog data, run it through an on-board DSP, and then push results out over Wi-Fi, Bluetooth, and a cellular link. To keep the unit fully portable, all power must be managed through an integrated battery management system, including charging, protection, and efficient rail generation for the analog, digital, and RF domains. Here’s what I need from you, start to finish: • Complete schematic capture with full part selection, paying special attention to RF front-ends, low-noise sensor inputs, the DSP section, and the battery management circuitry. • A 4–6 layer stack-up that cleanly separates noisy digital, sensitive analog, and RF zones, with controlled-impedance routing for the Wi-Fi, Bluetooth, and cellular paths. • Compact, fabrication-ready PCB layout that meets standard DFM/DFT guidelines and includes all required test points. • Final output package: native CAD files (Altium or KiCad are fine), Gerber/ODB++ set, pick-and-place, assembly drawing, and a complete, production-ready BOM. Acceptance will be based on a successful design review covering RF matching, power-integrity analysis, and confirmation that all sensor, DSP, and battery-related specs are met. If this end-to-end scope fits your expertise, I’d love to see how you can bring the design to life.
Skills
Fuente original: freelancer