Hybrid Circuit Assembler
Publicada el 2026-07-14
Descripción de la oferta
Job Description Job Description Responsibilities/Duties: 1. Manual placement of semiconductor dice in cleanroom environment 2. Use of tweezers, microscope and wire-bonder to manually place and connect semiconductor dice. 3. Operate automated and semi-automated die-attach and wire-bonding machines to position and attach semiconductor and other hybrid components 4. Work from approved drawings and assembly instructions with strict adherence to quality and environmental standards. Education : High …
Skills
Fuente original: adzuna:ca