Mixed-Component PCB Assembly
Publicada el 2026-07-16
Descripción de la oferta
I have a consumer-electronics board that combines both surface-mount and through-hole parts and now needs full turnkey assembly. I will supply the BOM, centroid/PnP file, and all component datasheets. What I need from you is the complete build—sourcing any missing passives, mounting every device, soldering, cleaning, and functional testing—so the boards arrive production-ready. Key points you should know: • Component mix is roughly 80 % SMD (0402–QFN) and 20 % through-hole, so the job will require automated pick-and-place with reflow plus a secondary wave or selective-solder pass. • different Board size, two layer FR-4, lead-free finish. Typical run will be 50 prototypes, scaling to 1 000 if the initial batch passes. • I expect optical inspection (AOI) on all boards and in-circuit or flying-probe test on a 10 % sample. Please document any rework performed. • Shipping is to the EU, so RoHS compliance and a short COC are mandatory. Deliverables 1. Fully assembled and cleaned boards, individually ESD-bagged. 2. AOI images and test log files in PDF or CSV. 3. Short build report noting solder paste, stencil thickness, oven profile, and any DFM feedback that could improve yield on the larger run. Acceptance criteria – 100 % pass rate on visual inspection. – ≤ 0.5 % electrical failure rate on the tested subset. – All reports match submitted build files. If these details fit your capabilities, let’s move straight to scheduling and component availability so we can lock in the first production slot.
Skills
Fuente original: freelancer